عکس | شماره قطعه تولیدکننده | موجودی | تعداد | دیتاشیت | سری | بسته بندی | وضعیت محصول | نوع ماژول/برد | پردازنده اصلی | پردازشگر مشترک | سرعت | اندازه فلش | اندازه RAM | نوع رابط | اندازه / ابعاد | دمای عملیاتی |
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TE0745-03-93E31-AKSOM WITH AMD ZYNQ 7045-3E AND HE Trenz Electronic GmbH |
0 |
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Zynq | Bulk | Active | MPU Core | ARM Cortex-A9 | Xilinx Zynq 7045 SoC XC7Z045-3FFG676E | - | 64MB | 1GB | Samtec ST5 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
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TE0783-02-92I33MAHIGH-PERFORMANCE SOM WITH XILINX Trenz Electronic GmbH |
0 |
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TE0782 | Bulk | Active | MPU Core | Zynq™ 7000 XC7Z045-2FFG900I | ARM Cortex-A9 | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 3.350" L x 3.350" W (85.00mm x 85.00mm) | -40°C ~ 85°C |
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TE0782-02-92I33MAIC MODULE CORTEX Trenz Electronic GmbH |
0 |
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TE0782 | Bulk | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 3.350" L x 3.350" W (85.00mm x 85.00mm) | -40°C ~ 85°C |
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TE0807-03-7AI21-AMPSOC ZYNQ USCALE 4GB DDR4 Trenz Electronic GmbH |
0 |
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TE0807 | Box | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU7CG-1FBVB900I | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
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TE0817-01-7DI21-AMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
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Zynq® UltraScale+™ | Bulk | Obsolete | MPU Core | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
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TE0807-03-7DI21-AZMPSOC MODULE WITH AMD ZYNQ ULTRA Trenz Electronic GmbH |
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Zynq UltraScale+ | Bulk | Obsolete | MPU Core | Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
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TEC0850-03-BBEX1-AIC MODULE Trenz Electronic GmbH |
0 |
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* | Bulk | Active | - | - | - | - | - | - | - | - | - |
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TE0865-02-ABI21MAMPSOC MODULE WITH ZYNQ ULTRASCAL Trenz Electronic GmbH |
0 |
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Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I | - | - | 256MB | 4GB | Board-to-Board (BTB) Socket | 3.937" L x 2.953" W (100.00mm x 75.00mm) | 0°C ~ 85°C |
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TE0865-02-FBE23MAMPSOC MODULE WITH ZYNQ ULTRASCAL Trenz Electronic GmbH |
0 |
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Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E | - | - | 256MB | 4GB | Board-to-Board (BTB) Socket | 3.937" L x 2.953" W (100.00mm x 75.00mm) | 0°C ~ 85°C |
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TE0865-02-DGE23MAMPSOC MODULE WITH ZYNQ ULTRASCAL Trenz Electronic GmbH |
0 |
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Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E | - | - | 256MB | 4GB | Board-to-Board (BTB) Socket | 3.937" L x 2.953" W (100.00mm x 75.00mm) | 0°C ~ 85°C |