عکس | شماره قطعه تولیدکننده | موجودی | تعداد | دیتاشیت | سری | بسته بندی | وضعیت محصول | نوع ماژول/برد | پردازنده اصلی | پردازشگر مشترک | سرعت | اندازه فلش | اندازه RAM | نوع رابط | اندازه / ابعاد | دمای عملیاتی |
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AM0010-02-3BI21MAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
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Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ ZU3EG-1I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.205" L x 1.575" W (56.00mm x 40.00mm) | -40°C ~ 85°C |
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AM0010-02-4DE21MAMPSOC MODULE WITH XILINX ZYNQ UL Trenz Electronic GmbH |
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Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ ZU4EV | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.220" L x 1.575" W (56.40mm x 40.00mm) | 0°C ~ 85°C |
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TE0803-01-04CG-1EAIC MODULE ZYNQ USCALE 2GB 128MB Trenz Electronic GmbH |
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TE0803 | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
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TE0803-02-04CG-1EBIC MODULE ZYNQ USCALE 2GB 256MB Trenz Electronic GmbH |
0 |
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![]() دیتاشیت |
TE0803 | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 256MB | 2GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
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TE0823-01-3PIU1MLICOBOARD Trenz Electronic GmbH |
0 |
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![]() دیتاشیت |
TE0823 | Bulk | Active | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | - | 128MB | 1GB | USB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
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TE0823-01-3PIU1MAICOBOARD Trenz Electronic GmbH |
0 |
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![]() دیتاشیت |
TE0823 | Bulk | Active | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | - | 128MB | 1GB | USB | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
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TE0741-05-B2C-1-AMODULE FPGA KINTEX Trenz Electronic GmbH |
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Kintex™-7 | Bulk | Active | FPGA | Xilinx Kintex-7 FPGA XC7K160T-2FBG676C | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 70°C |
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TE0745-02-72I31-AMOD SOM DDR3L 1GB Trenz Electronic GmbH |
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TE0745 | Bulk | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7030) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
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TE0715-05-73E33-ASOC MODULE WITH XILINX ZYNQ 7030 Trenz Electronic GmbH |
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TE0711 | Bulk | Active | MPU Core | Zynq™ XC7Z030-3SBG485E | ARM Cortex-A9 | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
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TE0745-03-72I31-ASOM WITH AMD ZYNQ 7030-2I, 1 GBY Trenz Electronic GmbH |
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Zynq | Bulk | Active | MPU Core | ARM Cortex-A9 | Xilinx Zynq 7030 SoC XC7Z030-2FBG676I | - | 64MB | 1GB | Samtec ST5 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |